Equipment/Capabilites


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A partial list of equipment includes:

bulletFuji pick and place machine
bulletElectrovert reflow oven
bulletManncorp wave soldering machine with interchangeable solder pots; lead free and leaded
bulletTransition Automation semi-automatic screen printer
bulletQ-Corporation lead trimming machine
bulletTOP point solder machine (mini-wave)
bulletAqua-Pure closed loop deionized water cleaning system
bulletDatapaq data logger



Circuit Board Assembly:  MFG Electronics’ primary focus is assembling through-hole, SMT, and mixed-technology printed circuit boards (PCBs) in both lead free and leaded versions.  We have experience assembling PCBs with components including lead pitch down to 15 mils, BGAs, passives down to 0402 technology, and a wide range of connectors and mechanical components. 


Final assembly test station for select jobs/customers




SMT and wave solder equipment


 

All PCBs are assembled to the latest revision of IPC-A-610, Class 2 requirements and all assembly personnel are trained to the same standard.  We test final assemblies per acceptance test procedures when specified by the customer.

 

Electro-Mechanical Assembly:  MFG Electronics provides added value by assembling PCBs into the next higher level mechanical or electro-mechanical assembly, whether in module or chassis form.  Typical higher level assemblies include power supplies and power chassis.

 


 


 

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